Research on soi pressure sensor packaging process 压力传感器封装工艺研究
Much attention has been focused in recent years on the research of fbg sensor package technology and the temperature and strain separation method . these two issues are the key problems for good practical application of the fbg sensors 光纤布拉格光栅传感器的封装技术与测试结果中的应变/温度效应分离技术都是目前国内外研究的热点,也是光纤布拉格光栅传感器应用于实际工程结构的重要先决条件。